Semiconductor

PrefactorTech conducts process analysis and research related to semiconductor industries, focusing on wafer boxes and photomask boxes. After design, integration, installation, and testing, it develops automated equipment for cleaning, drying, and assembly through robotics, mechanisms, and electronic systems.
The following automated equipment can be directly implemented. If adjustments to certain specifications are required, they can be tailored to meet customer needs.

6" POD Cleaner

The 6-inch Mask Package (POD) cleaning machine features fully automated POD disassembly, followed by robotic processes for automated cleaning, drying, baking, and purging. It also includes a procedure for particle inspection.

After POD disassembly, a dedicated cleaning tank is used to clean the Mask Package with pure water, aiming to remove particles.

A 6-joint robot is used to perform the drying and oven baking operations for the POD.

EOP/ EIP Cleaning and Drying Equipment

The EOP (External Layer) / EIP (Internal Layer) loading tower is equipped with a wetting function to prevent watermarks. The unloading tower adopts a wet-dry separation design to avoid contamination of the cleaned products.

The EOP (External Layer) / EIP (Internal Layer) cleaning and drying equipment uses a robot to perform dual-sided drying operations after ultrasonic cleaning, ensuring no residual water remains inside the holes.​​

The automated system utilizes robots for ultrasonic cleaning and oven baking, enabling the cleaning and baking processes for EOP (External Layer) and EIP (Internal Layer).​

300mm Wafer Carrier (FOUP) Assembly Cell

This system includes automated assembly of wafer carriers (FOUP) and automated measurement and adjustment of the gear rack. Operators place materials on the feed tower, and the robot automatically retrieves them for assembly. After assembly is completed, the gear rack is measured and adjusted automatically.

After operators place the main body, handle, bottom cover, and top cover into the material tower, the system can automatically retrieve them according to the specified design. With the integration of a vision system, it can perform automated fastening operations and upload fastening data to the system.

After assembly is completed, the robot, in conjunction with a 3D profilometer, measures the gear rack. The IPC then calculates the difference and performs automatic adjustments accordingly.

Wafer Carrier (FOUP) Panel Assembly Cell

After operators place the relevant components into the feed tower, the robot automatically positions the materials onto the fixture to begin the automated assembly process.

The robot places the flexible fasteners onto the main body, and the fixture completes the assembly of the components.​​

After the robot collaborates with the fixture to complete the assembly, it continues with flipping operations. Once completed, the finished product is placed on the output tower.